Support12/13/14 th Intel® Core（i3/i5/i7）Desk-top Grade Processor
Support 4800MHz DDR5 memory64.0GB
Support VGA、DP、HDMI、Dual display output，HDMI&DP support 4K @60Hz
2xRS-232，4xRS-232/422/485
3xUSB3.2，4xUSB3.0，2xUSB.0
Aluminum alloy die-casting shell, passive cooling
| SYSTEM PARAMETER | CPU | 1 x LGA1700 CPU Socket, supporting 12/13/14th Intel® Core (i3/i5/i7), Intel® Pentium, Intel® Celeron Processors (Recommended maximum TDP 65W processor) |
| Chipset | Intel H610 | |
| System Memory | 2 x 260Pin DDR5 SO-DIMM expansion slots, supporting 4800MHz DDR5, maximum capacity 64.0GB | |
| Display Output | VGA(Max:1920x1200 @ 60Hz), DP(Max:4096x2304 @ 60Hz), HDMI(Max:4096x2160 @ 60Hz). Arbitrary dual display output, HDMI & DP support dual 4K @60Hz UHD output | |
| Expansion Interfaces | 1 x Mini PCIE expansion slot (Supports Mini PCIE X1 device or 4G SIM card device optional) | |
| Ethernet | 4 x Intel 10/100/1000Mbps Controllers (I219-V x 1, I211-AT x 3), supporting PXE, WOL functions | |
| Audio | 1 x Ø3.5 PhoneJack audio output port, 1 x Ø3.5 PhoneJack MIC port | |
| Storage | 1 x 7+15Pin SATA III port (2.5" SATA hard drive bay); 1 x M.2 2280 (SATA/NVMEx4) slot; 1 x 7Pin SATA III port | |
| USB | 3 x USB3.2 ports, 4 x USB3.0 ports, 2 x USB2.0 ports | |
| Serial Ports | 2 x RS-232 standard DB9 ports (COM5, COM6); 4 x RS-232/422/485 ports (COM1~COM4); RS-485 supports hardware automatic data flow control, all above ports are non-isolated | |
| Other Interfaces & Functions | 1 x PS/2 mouse/keyboard port; Hardware forced power-on auto boot (Set PSJ1 pin status as needed); 256-level watchdog timer; On-board reserved 1 x LPT pin header, 1 x 16-Bit GPIO pin header, 1 x USB2.0 Wafer pin header | |
| Power Input | DC 9V～36V power input (Dual-layer Phoenix Terminal) | |
| Mechanical | Casing Composition | Die-cast aluminum alloy casing, painted front and rear panels |
| Color | Iron gray | |
| Dimensions | 271mm x 263.6mm x 95mm (W x D x H) | |
| Environmental Specifications | Operating Environment | Temperature: -20℃～60℃ (Wide-temperature storage devices required)Humidity: 5%～95% (Non-condensing) |
| Storage Environment | Temperature: -40℃～80℃Humidity: 5%～95% (Non-condensing) |
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